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US 2002/0164938 A1Published application
Carrier head with a compressible film
AssigneeApplied Materials, Inc., a Delaware corporation
InventorsHung Chih Chen, Steven M. Zuniga
Life of this patent
Estimating the term…
Abstract
A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.
Claims16
A carrier head, comprising:
- a housing;
- a rigid structure movably connected to the housing;
- a plurality of indentations formed in a bottom surface of the rigid structure;
- and
- a compressible film positioned on the bottom surface of the rigid structure, the indentations in the rigid structure disposed in a pattern to create a pressure distribution across a surface of a substrate during polishing.
2 more elements
A carrier head, comprising:
- a housing;
- a rigid structure movably connected to the housing;
- and
- a compressible film positioned on a bottom surface of the rigid structure, the compressible film including a plurality of regions of different compressibility, the regions of different compressibility disposed in a pattern to create a pressure distribution across a surface of a substrate during polishing.
1 more element
An article for use in a carrier head, comprising:
- a compressible film that is detachably securable to a surface of a rigid structure in the carrier head, the compressible film having a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity.
A kit comprising:
- a plurality of compressible films detachably securable to a bottom surface of the rigid structure, each compressible film having a plurality of apertures to create a non-uniform pressure distribution on a substrate during polishing, wherein at least two of the compressible films have apertures disposed in different patterns to create different pressure distributions on the substrate.
Dependencies are inferred from the claim text.