Polishing apparatus

A dressing method for dressing a polishing cloth provided in a polishing apparatus, wherein:

• initially conditioning said polishing cloth before use in the polishing, by a dressing unit comprising a diamond dresser or an SiC dresser;
• and
• conditioning said polishing cloth between processes of polishing said workpiece to be polished, by a dressing unit comprising a brush dresser.

A dressing method for dressing a polishing cloth provided in a polishing apparatus, wherein:

• initially conditioning said polishing cloth before use in the polishing, by a dressing unit comprising a diamond dresser or an SiC dresser;
• and
• between processes of polishing said workpiece to be polished, firstly conditioning said polishing cloth by a dressing unit comprising a diamond dresser or an SiC dresser, and then conditioning said polishing cloth by a dressing unit comprising a brush dresser.

A dressing method for dressing during polishing of a workpiece to be polished in a polishing apparatus, wherein:

• dressing is performed while swinging a dressing unit comprising a dresser having a diameter smaller than said workpiece to be polished;
• and
• after a top ring is withdrawn, dressing is performed by a dressing unit comprising a dresser having a diameter larger than said workpiece to be polished.

A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece against said polishing surface of said polishing table to polish said workpiece, said polishing apparatus comprising:

• a dresser for dressing said polishing surface of said polishing table is further provided, said dresser dressing an area of said polishing surface used for polishing a predetermined position of a surface, to be polished, of said workpiece in accordance with a film thickness to be polished in said predetermined position of said surface to be polished.

A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece against said polishing surface of said polishing table to polish said workpiece, said polishing apparatus comprising:

• a dressing unit integrally having a first dresser for dressing said polishing surface of said polishing table during polishing of said workpiece to be polished, and a second dresser for dressing said polishing surface of said polishing table when said workpiece to be polished is not polished.