Method and apparatus for conditioning a polishing pad
AssigneeApplied Materials, Inc., a Delaware corporation
InventorRobert D. Tolles
Life of this patent
Estimating the term…
Abstract
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.
Claims35
A method of chemical mechanical polishing, comprising:
- bringing a substrate into contact with a material that includes a mesh of fibers and a binder holding the fibers in the mesh, the binder coalesced among the fibers to leave pores in the interstices between the fibers of the mesh, wherein the fibers and binder provide the material with a brittle structure;
- supplying an abrasive slurry to the interface between the substrate and the material;
- and
- creating relative motion between the substrate and the material.
A method of chemical mechanical polishing, comprising:
- bringing a semiconductor wafer into contact with an automotive brake or clutch pad;
- supplying an abrasive slurry to the interface between the wafer and the pad;
- and
- creating relative motion between the wafer and the pad.
An article for chemical mechanical polishing of a substrate, comprising:
- a layer of polishing material having a mesh of fibers and a binder material holding the fibers in the mesh, the binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh;
- and
- a polishing surface to contact and polish a substrate;
- wherein the fibers and binder material provide the polishing material with a brittle structure.
An article for polishing of a substrate, comprising:
- a layer of polishing material having a mesh of fibers and a binder material holding the fibers in the mesh, the binder material coalesced around the fibers to leave pores in the interstices in the fiber mesh;
- and
- a polishing surface to contact and polish a substrate;
- wherein at least the binder material is sufficiently brittle that a lateral force created by relative motion between a substrate and the polishing surface tends to cause fragments of the fibers and the binder material at the surface to break away from the layer of polishing material.
An article for polishing of a substrate, comprising:
- a layer of polishing material having a mesh of cellulose fibers and a phenolic resin binding the fibers in the mesh, the resin coalesced around the fibers to leave pores in the interstices in the fiber mesh;
- and
- a polishing surface to contact and polish a substrate.
A chemical mechanical polishing apparatus, comprising:
- a carrier head to hold a substrate;
- a polishing pad including a mesh of fibers and a binder material holding the fibers in the mesh, the binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh, wherein the fibers and binder material provide the polishing pad with a brittle structure;
- and
- a slurry supply port to dispense a polishing slurry to the polishing pad.
A method of forming a polishing material, comprising:
- mixing a liquid binder material with fibers to form a pulp;
- drying the pulp to cure the binder material and create a composite material including a fiber mesh held by the binder material, the binder material coalesced among the fibers to create a leave pores in the interstices between the fibers of the mesh, the composite material being relatively brittle.
A chemical mechanical polishing apparatus, comprising:
- a first piece of a polishing material;
- a carrier to hold a substrate in contact with a surface of the first piece of the polishing material;
- and
- a conditioner apparatus having a second piece of the polishing material movable into contact with the surface of the first piece of polishing material.
A method of chemical mechanical polishing, comprising:
- bringing a substrate into contact with a first polishing surface that includes a polishing material;
- causing relative motion between the substrate and the polishing surface;
- and
- conditioning the polishing surface with the same material as the polishing surface.
A method of chemical mechanical polishing, comprising:
- supplying a slurry to a polishing pad having a plurality of pores therein;
- bringing a substrate into contact with a polishing surface of the polishing pad;
- causing relative motion between the substrate and the polishing surface;
- directing a spray of a cleaning liquid onto the pad to remove slurry from the pores;
- and
- directing a jet of gas onto the polishing pad to remove the cleaning liquid crom the pad.
Dependencies are inferred from the claim text.