Chemical-mechanical polishing methods
AssigneeMicron Technology, Inc.
InventorMichael T. Andreas
Life of this patent
Estimating the term…
Abstract
A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the substrate. Applying solid abrasive material can include applying a CMP slurry or a polishing pad comprising abrasive material. Such a method can further include applying a surfactant comprising material to the substrate to assist in effectuating flocculation of the abrasive material. Such surfactant comprising material may be cationic which includes, for example, a quaternary ammonium substituted salt. Also, for example, the surfactant comprising material may be applied during polishing, brush scrubbing, pressure spraying, or buffing.
Claims70
A chemical-mechanical polishing (CMP) method comprising:
- applying a solid abrasive material to a substrate;
- polishing the substrate with the abrasive material;
- flocculating at least a portion of the abrasive material on the substrate;
- and
- removing at least a majority portion of the flocculated portion of the abrasive material from the substrate.
A CMP method comprising:
- applying a solid abrasive material to a substrate;
- polishing the substrate with the abrasive material;
- applying a surfactant comprising material to the substrate and flocculating at least a portion of the abrasive material with the surfactant comprising material;
- removing at least a majority portion of the flocculated portion of the abrasive material from the substrate.
A CMP method comprising:
- applying a CMP slurry comprising substantially dispersed, solid abrasive material to a substrate;
- polishing the substrate with the slurry;
- applying to the substrate a surfactant comprising material that exhibits the characteristic of decreasing a settling time for the abrasive material in an aqueous dilution of the slurry;
- removing at least a majority portion of the abrasive from the substrate.
A CMP method comprising:
- applying a CMP slurry comprising substantially dispersed, solid abrasive material to a substrate;
- polishing the substrate with the slurry;
- applying to the substrate a surfactant comprising material, wherein the surfactant exhibits a one-hour settling rate constant of greater than 0.035 for the abrasive material in an aqueous mixture of about 0.1 weight percent surfactant and about 1 weight percent slurry;
- removing at least a majority portion of the abrasive material from the substrate.
A CMP method comprising:
- applying a ceria-based solid abrasive material to a substrate;
- polishing the substrate with the abrasive material;
- applying a cationic surfactant comprising material to the substrate and flocculating at least a portion of the abrasive material;
- and
- removing at least a majority portion of the flocculated portion of the abrasive material from the substrate.
A CMP method comprising:
- applying a solid abrasive material to a substrate;
- polishing the substrate with the abrasive material;
- after polishing, brush scrubbing the substrate using a scrubbing solution comprising a surfactant material to flocculate and remove at least a majority portion of the abrasive material.
A CMP method comprising:
- applying a solid abrasive material to a substrate;
- polishing the substrate with the abrasive material;
- after polishing, pressure spraying the substrate using a spray solution comprising a surfactant material to flocculate and remove at least a majority portion of the abrasive material.
A CMP method comprising:
- applying a solid abrasive material to a substrate;
- primary polishing the substrate with the abrasive material;
- buffing the substrate along with applying a surfactant comprising material to the substrate and flocculating at least a portion of the abrasive material with the surfactant comprising material;
- and
- removing at least a majority portion of the flocculated portion of the abrasive material from the substrate.
Dependencies are inferred from the claim text.