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US 2002/0164879 A1Published application
Methods of forming microstructure devices
AssigneeApplied Materials, Inc.
InventorsToi Yue Becky Leung, Jeffrey D. Chinn
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Abstract
The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.
Claims48
A method of forming a microstructure device, comprising:
- providing a reaction chamber;
- providing a substrate within the reaction chamber, the substrate having a first surface spaced from a second surface, the substrate ultimately being incorporated into a microstructure device, the first and second surfaces ultimately being movable relative to one another in the microstructure device;
- introducing alkylsilane-containing molecules into the reaction chamber in a vapor phase;
- and
- exposing at least one of the first and second surfaces to the alkylsilane-containing molecules within the reaction chamber to form a coating on the at least one of the first and second surfaces.
2 more elements
A method of forming a microstructure device, comprising:
- providing a substrate having a first semiconductive material surface separated from a second semiconductive material surface by a gap;
- exposing at least one of the first and second semiconductive material surfaces to OH radicals;
- and
- after the exposure to the OH radicals, exposing the at least one of the first and second semiconductive material surfaces to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second semiconductive material surfaces.
1 more element
A method of forming a microstructure device, comprising:
- providing a substrate having a first material, a second material, and a sacrificial material between the first and second materials;
- exposing the substrate to a vapor-phase etchant which removes the at least some of the sacrificial material from between the first and second materials to leave a surface of the first material spaced from a surface of the second material by a gap;
- the surface of the first material being defined as a first surface and the surface of the second material being defined as a second surface;
- and
- exposing at least one of the first and second surfaces to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the surfaces.
2 more elements
Dependencies are inferred from the claim text.