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AssigneeIndustrial Technology Research Institute
InventorsSzu-Wei Lu, Ming Lu, Jyh-Rong Lin
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A method for forming a wafer level package incorporating a multiplicity of elastomeric blocks as stress buffering layer and package formed are described. The method incorporates the step of forming metal lines in-between the plurality of IC dies on a wafer during the same process used for forming the metal vias. The metal lines are subsequently removed by either a mechanical method such as dicing with a diamond saw or by a chemical method such as wet etching. The method allows the fabrications of a wafer level package that has a multiplicity of elastomeric blocks formed on top as stress buffering layer without the CTE mismatch problem with other layers on the wafer.
A method for forming a wafer level package incorporating a multiplicity of elastomeric blocks comprising the steps of:
A wafer level package having a multiplicity of elastomeric blocks on top comprising:
Dependencies are inferred from the claim text.