Method of manufacturing printed circuit board

Abstract

A method of manufacturing a printed circuit board comprising the steps of: providing a substrate in which conductor circuits have been formed; forming a solder resist layer on the surface of the substrate; pre-curing the solder resist; imaging and developing the solder resist layer so as to form a desired solder resist pattern wherein a solder resist scum is remained on the substrate; post-curing the solder resist; and removing the solder resist scum. The solder resist scum removing step may be conducted by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, or a sand blasting process. The present invention further provides a method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon. The adhesion improving method mainly comprises roughening the solder resist layer on the circuitized substrate by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, a sand blasting process, or by a scrubbing process.

Dependencies are inferred from the claim text.