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US 2002/0164832 A1Published application
Method for separating silica waveguides
OwnerAmir Mirzainventor
Life of this patent
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Abstract
A method is provided for separating silica waveguides made in multiple units on a wafer at the end of fabrication. Streets are formed between adjacent waveguides by etching the IC material to a substrate. The substrate is then sawed along the streets.
Claims6
A method for separating silica waveguides, said waveguides comprising a wafer, and IC material disposed on said wafer, comprising the steps of:
- forming streets between adjacent waveguides on the wafer;
- and
- dicing said wafer along said streets.
Dependencies are inferred from the claim text.