US 2002/0164485 A1 · Structural modified epoxy adhesive compositions

Abstract

The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Claims43

Dependent claims

A two-component adhesive composition, which comprises:

(a) a resin pack comprising an epoxy resin and silane coupling agent;
(b) curative pack comprising an aliphatic amine and a polyamine.

Dependencies are inferred from the claim text.

Facts

Application

09/793,070Filed 26 Feb 2001

Published

7 Nov 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification24 codes

B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 27/08
As the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/38
Layered products comprising a layer of synthetic resin: comprising epoxy resins
C08F 8/42
Chemical modification by after-treatment: introducing metal atoms or metal-containing groups

Structural modified epoxy adhesive compositions

Life of this patent

Structural modified epoxy adhesive compositions

Life of this patent

Abstract

Claims43