US 2002/0164241 A1 · Method for handling and processing microelectronic-device substrate assemblies

Abstract

Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path. The clamp is coupled to the second section of the arm in alignment with the processing path. A motor is coupled to the arm via a drive member to move the arm along the guide member between a first position in which the clamp is near the first side of the plate assembly and a second position in which the clamp is near the cassette at the second side of the plate assembly.

Claims13

Dependent claims

A method for handling a wafer assembly having a frame, a backing film attached to the frame, and a microelectronic-substrate assembly attached to the backing film, the method comprising:

moving a clamp of a substrate handling apparatus at an elevation along a processing path through a processing station of a processing machine by sliding an arm attached to the clamp along a guide member having an elongated shape corresponding to the processing path, the clamp being selectively moved between a first position at a first side of the processing station to hold a substrate assembly at the processing station and a second position at a second side of the processing station to grip or release a selected frame and substrate assembly in the cassette;
and
operating the clamp in the second position by either gripping the selected frame to carry the substrate assembly from the second position to the first position at the processing station, or releasing the selected frame to place the selected frame and substrate assembly back in the cassette.

A method of handling a wafer assembly having a frame, a backing film attached to the frame, and a microelectronic-device substrate assembly attached to the backing film, the method comprising:

translating an arm along a guide member having an elongated shape extending along a processing machine at least substantially parallel to a processing path running from a first side of a processing station to a second side of the processing station proximate to a cassette of substrate assemblies coupled to frames;
positioning at least a portion of the arm over the processing path as the arm translates along the guide member;
and
selectively closing the clamp to grip a selected frame and substrate assembly to carry the selected substrate assembly from the wafer cassette to the processing station, and selectively opening the clamp to release the selected frame and substrate assembly to place the selected substrate assembly back in the cassette.

1 more element

Dependencies are inferred from the claim text.

Method for handling and processing microelectronic-device substrate assemblies

Life of this patent

Method for handling and processing microelectronic-device substrate assemblies

Life of this patent

Abstract

Claims13