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US 2002/0164107 A1Published application
Electrical transmission frequency of SiOB
AssigneeCorning Incorporated
InventorsRobert A. Boudreau, Songsheng Tan, Christopher L. Henning, Karen I. Matthews
Life of this patent
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Abstract
An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330, 230, and/or 30) forming a transmission line (340) for propagating high frequency signals.
Claims20
An opto-electronic platform, comprising:
- a high resistivity substrate having an optical waveguide mounting portion, an optical device mounting portion, and an electrical waveguide portion having a conductor pattern and an underlying capacitance forming a transmission line for propagating high frequency signals.
An opto-electronic platform, comprising:
- a coplanar waveguide having a center conductor and a surrounding pair of RF ground conductors separated from the center conductor by a gap spacing;
- a high resistivity substrate having an electrical waveguide portion;
- and
- a dielectric layer interposed between the electrical waveguide portion of the high resistivity substrate and the center conductor and the pair of RF ground conductors of the coplanar waveguide and absent in the gap spacing.
1 more element
A method for making a high-speed propagating platform, comprising the steps of:
- providing a high resistivity substrate having an electrical waveguide portion;
- thermally oxide coating a dielectric over the high resistivity substrate;
- growing a metallized coplanar waveguide pattern having a center conductor and a surrounding pair of RF ground conductors separated from the center conductor by a gap spacing over the dielectric oxide;
- and
- removing the dielectric oxide on top of the high resistivity substrate in the gap spacing.
2 more elements
Dependencies are inferred from the claim text.