Memory module having balanced data i/o contacts pads
AssigneeSun Microsystems, Inc.
InventorsLam S. Dong, Drew G. Doblar
Life of this patent
Estimating the term…
Abstract
A memory module having balanced data input/output contacts. A memory module includes a printed circuit board having an edge connector and a plurality of memory integrated circuits. The edge connector may be adapted for insertion into a socket of a motherboard of a computer system, for example. The edge connector includes a plurality of contact pads on both sides of the printed circuit board. The contact pads are configured to convey data signals, power and ground to and from the printed circuit board. The power and ground contact pads alternate along the edge connector. There are no more than four data signal contact pads without intervening power or ground contact pads.
Claims12
A memory module for memory expansion in a computer system, said memory module comprising:
- a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
- wherein said plurality of contact pads are configured to convey data signals, power and ground to and from said printed circuit board;
- wherein said power and ground contact pads alternate along said connector edge with no more than four adjacent data signal contact pads without intervening power or ground contact pads;
- and
- a plurality of memory chips mounted on said printed circuit board.
A computer system comprising:
- a processor;
- a memory controller coupled to said processor through a system bus;
- a memory bus coupled to said memory controller;
- a main memory subsystem coupled to said memory bus, said main memory subsystem comprising:
- at least one memory module coupled to said memory bus, wherein said at least one memory module includes:
- a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
- wherein said plurality of contact pads are configured to convey data signals, power and ground to and from said printed circuit board;
- wherein said power and ground contact pads alternate along said connector edge with no more than four adjacent data signal contact pads without intervening power or ground contact pads;
- and
- a plurality of memory chips mounted on said printed circuit board.
A memory module for memory expansion in a computer system, the memory module comprising:
- a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
- wherein said plurality of contact pads includes evenly spaced power and ground contact pads in an alternating arrangement with no more than four data signal contact pads between an adjacent pair of power and ground contact pads;
- a plurality of memory chips mounted on said printed circuit board.
Dependencies are inferred from the claim text.