Integrated cooling of a printed circuit board structure
AssigneeEricsson Inc.
InventorsRobert Bartola, James Mogel, Steven J. Laureanti
Life of this patent
Estimating the term…
Abstract
A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.
Claims23
A printed circuit board (PCB), comprising:
- a mounting area for attaching one or more heat producing devices;
- and
- a coolant circulation channel at least partially formed in a layer of the PCB, the channel having a portion in a vicinity of the mounting area.
An assembly comprising a heat-generating device attached to a printed circuit board (PCB), and a thermal management system, the thermal management system comprising a coolant circulation channel at least partially formed in a layer of the PCB.
Dependencies are inferred from the claim text.