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AssigneeOMRON Corporation
InventorsMitsuru Fujii, Minoru Sakata, Tomonori Seki, Shobu Sato
Estimating the term…
Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21). Through holes (26, 27) of the silicon substrate (21) through which the signal lines (23, 24) are passed and through holes (28, 29) of the silicon substrate (21) through which the wiring conductors (30, 31) are passed are hermetically sealed by a movable substrate (40) or a cap (50).
An electrostatic relay in which a movable electrode of a movable substrate resiliently supported so as to be opposed to a fixed electrode formed on a stationary substrate is driven based on electrostatic attraction caused between the fixed electrode and the movable electrode, and a plurality of fixed contacts provided on the stationary substrate and a movable contact provided on the movable substrate are brought into contact with each other and separated from each other,
Dependencies are inferred from the claim text.