Probe card and method of producing the same

A method for forming a contactor on a substrate of a probe card electrically coupled to a plurality of contact terminals provided on a circuit under test for performing signal transmission between said circuit under test and an external semiconductor testing equipment, said contactor contacting to said contact terminal, comprising steps of:

• forming a sacrificial layer on a predetermined area of said substrate;
• forming an amorphous material layer comprising an amorphous material having a supercooled liquid phase region on said sacrificial layer and said substrate;
• forming a cantilever of an amorphous material comprising a free unit as a portion of it by removing said sacrificial layer between a portion of said amorphous material layer and said substrate, said free unit being separated from said substrate;
• and
• forming said contactor by bending said free unit toward a predetermined direction from said substrate.

A method for forming a contactor on a substrate of a probe card electrically coupled to a plurality of contact terminals provided on a circuit under test for performing signal transmission between said circuit under test and an external semiconductor testing equipment, said contactor contacting to said contact terminal, comprising steps of:

• forming an amorphous material layer comprising an amorphous material having a supercooled liquid phase region on said substrate;
• forming a free unit on a portion of said amorphous material layer by removing a portion of said substrate under said portion of said amorphous material layer, said free unit being separated from said substrate;
• and
• forming said contactor by bending said free unit toward a predetermined direction from said substrate.

A semiconductor chip comprising:

• a plurality of pads;
• and
• a plurality of contactors made of an amorphous material having a supercooled liquid phase region on said plurality of pads,
• wherein said contactor is extended to a predetermined direction from a surface of said pads.

A semiconductor device comprising a semiconductor chip having a plurality of pads, comprising:

• a plurality of electrode leads;
• and
• a package which packs said semiconductor chip,
• wherein said pads of said semiconductor chip and said electrode leads are electrically coupled to each other through contactors made of an amorphous material having a supercooled liquid phase region.

A semiconductor device comprising a semiconductor chip having a plurality of pads, comprising:

• a plurality of external terminal balls;
• and
• a package which packs said semiconductor chip,
• wherein said pads of said semiconductor chip and said external terminal balls are electrically coupled to each other through contactors made of an amorphous material having a supercooled liquid phase region.