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US 2002/0163083 A1Published application
Semiconductor device
AssigneeNEC Electronics Corporation
InventorsKeisuke Hatano, Takahisa Abiru
Life of this patent
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Abstract
A semiconductor device according to the present invention comprises a substrate; a copper interconnect layer formed on the top surface side of the substrate; an aluminum bonding pad formed on the top surface side of the copper interconnect layer with an aluminum-based material; and an aluminum interconnect formed on the top surface side of the copper interconnect layer with an aluminum-based material.
Claims6
A semiconductor device comprising:
- a substrate;
- a copper interconnect layer formed on the top surface side of said substrate;
- an aluminum bonding pad formed on the top surface side of said copper interconnect layer with an aluminum-based material;
- and
- an aluminum interconnect formed on the top surface side of said copper interconnect layer with said aluminum-based material.
2 more elements
Dependencies are inferred from the claim text.