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US 2002/0163078 A1Published application
Lead frame for an integrated circuit chip (integrated circuit peripheral support)
AssigneeInstitute of Microelectronics
InventorsTai-Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Raymundo Camenforte, Eric Neo, Daniel Yap
Life of this patent
Estimating the term…
Abstract
A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.
Claims25
A lead frame for an integrated circuit chip having a bottom surface, comprising:
- one or more sidebars,
- each of said one or more sidebars having an inner side and an outer side,
- each said inner side defining a boundary of a chip-accommodating zone,
- said zone being sized to accommodate the chip entirely therewithin, and
- a plurality of ears being connected to at least one of said inner sides and protruding into said chip-accommodating zone, each ear having an upper surface for engaging the bottom of the chip in confronting relation.
2 more elements
A lead-frame for connecting and supporting an integrated circuit chip, comprising:
- sidebars having inwardly extending ears for supporting the chip, and having open crack-stop areas therebetween.
An integrated circuit package comprising:
- a lead frame,
- an integrated circuit chip secured to the frame, said chip having a lower frame-engaging surface,
- said frame comprising a plurality of sidebars, each having opposite ends, and having an inner side and an outer side, said sidebars defining a chip-accommodating zone, said zone being sized to accommodate the chip entirely within the inner sides of the sidebars,
- a plurality of ears each being connected to an inner side and protruding into said chip-accommodating zone, each ear having an upper chip-supporting surface for engaging the bottom of the chip in confronting relationship and defining a contact area;
- a chip attach material disposed between each of the chips in the contact area for securing the chip to the frame;
- an encapsulation material surrounding the chip and the frame and being bonded thereto;
- said ears defining crack-stop areas between the ears and adjacent the sidebars.
4 more elements
Dependencies are inferred from the claim text.