Semiconductor device with layered semiconductor chips
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsWataru Kuwahara, Katsunori Horie
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Abstract
A first semiconductor chip having a pad electrode on its main surface is disposed on a substrate, and a first wiring film electrically connecting the pad electrode to the substrate is further disposed on the substrate so as to cover the first semiconductor chip. A second semiconductor chip is disposed on the first wiring film. The second semiconductor chip has a pad electrode on its main surface opposite to another surface on which the first wiring film is disposed. A second wiring film electrically connecting the pad electrode to the substrate is disposed on the substrate so as to cover the first semiconductor chip and the second semiconductor chip.
Claims19
A semiconductor device comprising:
- a substrate;
- a first semiconductor chip disposed on said substrate, said first semiconductor chip having a first electrode on a main surface thereof;
- a first wiring disposed on said substrate so as to cover said first semiconductor chip, said first wiring electrically connecting said first electrode to said substrate;
- a second semiconductor chip disposed on said first wiring, said second semiconductor chip having a second electrode on a main surface thereof, the main surface being opposite to another surface which contacts with said first wiring;
- and
- a second wiring disposed on said substrate so as to cover said second semiconductor chip and said first semiconductor chip, said second wiring electrically connecting said second electrode to said substrate.
A semiconductor device comprising:
- a substrate;
- a first semiconductor chip disposed on said substrate, said first semiconductor chip having a first electrode on a main surface thereof;
- a wiring disposed on said substrate so as to cover said first semiconductor chip, said wiring electrically connecting said first electrode to said substrate;
- and
- a second semiconductor chip disposed on said wiring, said second semiconductor chip having a second electrode on a main surface thereof;
- the main surface of said second semiconductor chip facing the main surface of said first semiconductor chip.
A semiconductor device comprising:
- a first semiconductor chip having a first electrode on a main surface thereof;
- a wiring disposed on said first semiconductor chip so as to be in close contact with the main surface of said first semiconductor chip, said wiring electrically connecting said first electrode to said substrate;
- a second semiconductor chip disposed on said wiring, said second semiconductor chip having a second electrode on a main surface thereof, the main surface of said second semiconductor chip facing the main surface of said first semiconductor chip and being in close contact with said wiring;
- and
- a sealant sealing said first semiconductor chip and said second semiconductor chip.
Dependencies are inferred from the claim text.