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AssigneeSiliconware Precision Industries Co., Ltd.
InventorsTzong Da Ho, Chien Ping Huang
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A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the positioning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned heat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e. an exposed side of the heat sink to the atmosphere, so that the heat-dissipating efficiency is increased, and the semiconductor package is more cost-effective to fabricate.
A semiconductor package, which comprises:
Dependencies are inferred from the claim text.