Chip mount, methods of making same and methods for mounting chips thereon
OwnerRobert A. Martininventor
Life of this patent
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Abstract
The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in electrical communication with the wires of at least one leadframe and a receiving area for an integrated circuit chip. The present invention also describes chips mounted on the pre-fabricated mount and methods for mounting, wire-bonding and encapsulating the chip in the mount. The mounts of the present invention can also be adapted to accommodate multiple chips and multi-level bonding schemes to the chips.
Claims24
A chip mount comprising:
- a. a mount body;
- b. at least one flag area designed to receive a chip;
- c. a plurality of leads extending from each flag area out past the mount body electrically insulated one form the other.
A mounted chip comprising:
- a. a chip mount including:
- i mount body;
- ii. at least one flag area;
- iii. a plurality of leads extending from each flag area out past the mount body electrically insulated one form the other;
- b. a chip adhesively attached to each flag area;
- c. a plurality of electrically conductive wire bonds connecting a plurality of contacts on the chip to a flag area end of the leads;
- and
- d. a cover encapsulating the adhesively bonded chip and the wire bonds.
A method for making the mount comprising the steps of:
- a. forming a pre-mount comprising:
- i. a mount body;
- ii. at least one flag area designed to receive a chip;
- and
- iii. a plurality of leads extending from each area out past the mount body electrically insulated one form the other.
A method for mounting a chip comprising the steps of:
- a. forming a pre-mount comprising:
- i. a mount body;
- ii. at least one flag area designed to receive a chip;
- and
- iii. a plurality of leads extending from each area out past the mount body electrically insulated one form the other;
- b. adhesively bonding a chip into each flag area;
- c. wire bonding a plurality of contacts on the chip to a flag area end of the leads to place the contacts in electrically communication with the leads;
- d. encapsulating the structure of steps a-c in a non-conductive material to protect the chip and the wire bonds;
- and
- e. removing the protective ring and the bridges to produce a mounted chip.
Dependencies are inferred from the claim text.