Semiconductor package and method for fabricating the same

A method for fabricating a semiconductor package, comprising the steps of:

• providing a lead frame having a first side and a second side, wherein the lead frame is formed with a die pad and a plurality of leads surrounding the die pad, and the leads are each defined into an inner lead, an outer lead and a middle portion positioned between the inner lead and the outer lead, with each of the middle portions extending outwardly at sides thereof to form protrusions;
• forming an encapsulant to encapsulate the lead frame with the outer leads being exposed, wherein a cavity is formed in the encapsulant for exposing the die pad and the inner leads on the first side of the lead frame, allowing a semiconductor chip and bonding wires to be received in the cavity;
• mounting a semiconductor chip in the cavity on the die pad of the first side of the lead frame;
• forming a plurality of bonding wires in the cavity to electrically connect the semiconductor chip to the inner leads of the lead frame;
• and
• adhering a lid onto the encapsulant to cover an opening of the cavity.