US 2002/0163064 A1 · Enhanced BGA grounded heatsink

Abstract

A new method is provided for the establishment of a low resistivity connection between a wire bonded IC chip that is mounted on a heatsink and the heatsink of the package. A copper trace connection is allocated for this purpose on the surface of the substrate layer to which the IC chip is connected. An opening is provided in the substrate layer of the package, this opening aligns with the copper trace that has been allocated for establishing a ground connection and penetrates the substrate layer down to the surface of the underlying heatsink. The opening is filled with a conductive epoxy or an equivalent low-resistivity material thereby establishing a direct electrical connection or short between the allocated copper trace and the underlying heatsink. By connecting the ground point of the IC chip to the allocated copper trace, a direct electrical low resistivity connection is made between the ground point of the IC chip and the heatsink into which the IC chip is mounted.

Claims33

Dependent claims

A package for packaging an Integrated Circuit die in a cavity that is provided in a heatsink for said packaging of said Integrated Circuit, said Integrated Circuit die having a top surface in addition to having a bottom surface in addition to having sidewalls, said IC die further having a ground point, said packaging to comprise the establishment of a ground connection between said Integrated Circuit die and said heatsink, comprising:

a substrate layer comprising three layers;
a heatsink said heat sink having been provided with a cavity, said cavity having a bottom in addition to having sidewalls, said bottom having a surface;
a first adhesive layer for attaching said IC die to said heatsink;
a second adhesive layer for attaching said IC die to said heatsink;
a plurality of wire bond connections having been established between said IC die and said substrate layer;
and
a plurality of solder balls.

4 more elements

A method for packaging an Integrated Circuit die in a cavity that is provided in a heatsink for said packaging of said Integrated Circuit, said Integrated Circuit die having a top surface in addition to having a bottom surface in addition to having two sidewalls, said IC die further having a ground point, said packaging to comprise the establishment of a ground connection between said Integrated Circuit die and said heatsink, comprising the steps of:

providing an Integrated Circuit die whereby said Integrated Circuit die is a flip chip device;
providing a substrate layer comprising three layers;
providing a heatsink, said heat sink having a cavity, said cavity having a bottom in addition to having sidewalls, said bottom having a surface;
providing a first adhesive layer for attaching said IC die to said heatsink;
providing a second adhesive layer for attaching said IC die to said heatsink;
providing a plurality of wire bond connections being established between said IC die and said substrate layer;
and
providing a plurality of solder balls.

5 more elements

A package for packaging an Integrated Circuit die in a cavity that is provided in a heatsink for said packaging of said Integrated Circuit, said Integrated Circuit die having a top surface in addition to having a bottom surface in addition to having sidewalls, said IC die further having ground points, said packaging to comprise the establishment of a plurality of ground connections between said Integrated Circuit die and said heatsink, comprising:

a substrate layer comprising three layers;
a heatsink, said heat sink having a cavity, said cavity having a bottom in addition to having sidewalls, said bottom having a surface;
a first adhesive layer for attaching said IC die to said heatsink;
a second adhesive layer for attaching said IC die to said heatsink;
a plurality of wire bond connections being established between said IC die and said substrate layer;
and
a plurality of solder balls.

4 more elements

Dependencies are inferred from the claim text.

Enhanced BGA grounded heatsink

Life of this patent

Enhanced BGA grounded heatsink

Life of this patent

Abstract

Claims33