Radio frequency semiconductor apparatus
AssigneeSharp Kabushiki Kaisha
InventorShinji Kamiya
Life of this patent
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Abstract
According to one aspect of the present invention, there is provided a radio frequency (RF) semiconductor apparatus including a RF semiconductor circuit chip; a substrate on which the RF semiconductor circuit chip is mounted; and a signal line and a corresponding ground line for connecting the RF semiconductor circuit chip to the substrate. In this apparatus, the signal line and the ground line are arranged in such positions that a magnetic field created by the signal line and a magnetic field created by the ground line substantially cancel each other.
Claims20
A radio frequency (RF) semiconductor apparatus, comprising:
- a RF semiconductor circuit chip;
- a substrate on which the RF semiconductor circuit chip is mounted;
- and
- a signal line and a corresponding ground line for connecting the RF semiconductor circuit chip to the substrate, wherein
- the signal line and the ground line are arranged in such positions that a magnetic field created by the signal line and a magnetic field created by the ground line substantially cancel each other.
A radio frequency (RF) semiconductor apparatus, comprising:
- a RF semiconductor circuit chip;
- a substrate on which the RF semiconductor circuit chip is mounted;
- and
- a plurality of pairs of signal lines and ground lines, each pair comprising a signal line and a corresponding ground line, for connecting the RF semiconductor circuit chip to the substrate, wherein
- the signal line and the ground line are arranged in such positions that a magnetic field created by the signal line and a magnetic field created by the ground line substantially cancel each other in each of the plurality of pairs.
Dependencies are inferred from the claim text.