Plastic semiconductor package
AssigneeChipPAC, Inc.
InventorsSang D. Lee, Flynn Carson, Ki T. Ryu, Koo H. Lee
Life of this patent
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Abstract
A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die attach region on an upper surface of the paddle, wherein a portion of the upper surface of the paddle is recessed. In some embodiments the recessed portion of the upper surface of the paddle includes the die attach region, and in other embodiments the recessed portion of the upper surface of the paddle includes a groove. Also, a lead frame surface mount chip package including such a lead frame.
Claims15
A lead frame for a surface mount semiconductor chip package, comprising a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die attach region on an upper surface of the paddle, wherein a portion of the upper surface of the paddle is recessed.
A nonleaded molded package having a second die stacked over a first die attached on a die attach region of a surface of a lead frame.
Dependencies are inferred from the claim text.