Back to results
US 2002/0163001 A1Published application
Surface mount light emitting device package and fabrication method
OwnerDavid Mulford Shaddockinventor
Life of this patent
Estimating the term…
Abstract
A surface mount light emitting device package comprises: a surface mount lead frame comprising a thermally and electrically conductive reflector cup and leads; a light emitting device situated within the reflector cup and coupled to the leads; and encapsulant disposed around the light emitting device and around the reflector cup.
Claims33
A surface mount light emitting device package comprising:
- a surface mount lead frame comprising a thermally and electrically conductive reflector cup and leads;
- a light emitting device situated within the reflector cup and coupled to the leads;
- and
- encapsulant disposed around the light emitting device and around the reflector cup.
1 more element
A surface mount light emitting device package comprising:
- a surface mount lead frame comprising an integral thermally and electrically conductive reflector cup and leads, the reflector cup being electrically coupled to one lead and electrically separated from at least one lead;
- a light emitting device situated within the reflector cup and coupled to the leads;
- and
- encapsulant disposed around the light emitting device and around the reflector cup.
1 more element
A method for fabricating a surface mount light emitting device package comprising:
- situating a light emitting device within a thermally and electrically conductive reflector cup of a surface mount lead frame, the lead frame comprising leads;
- coupling the light emitting device to the leads;
- and
- disposing encapsulant around the light emitting device and around the reflector cup.
1 more element
Dependencies are inferred from the claim text.