Semiconductor chip
AssigneeNEC Electronics Corporation
InventorTakashi Kato
Life of this patent
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Abstract
To provide a semiconductor chip in which area occupied by TEG elements or area occupied by TEG-measuring electrode pads in the semiconductor chip can be reduced without reducing the number of TEG elements and complicating circuit configuration. The TEG element is formed in an empty space existing between an assembly and TEG-measuring electrode pad and the TEG-measuring electrode pad. An assembly electrode pad and the assembly and TEG-measuring electrode pad are electrically connected to a semiconductor element through internal wiring, and the assembly and TEG-measuring electrode pad and the TEG-measuring electrode pad are connected to the TEG element through an internal wiring.
Claims10
A semiconductor device attaining a circuit function, comprising:
- a plurality of circuit elements which are used to attain said circuit function;
- at least one TEG element which is not used to attain said circuit function;
- a plurality of bonding pads which are used to supply and receive signals to or from said circuit elements, at least one of said bonding pads being used in common for said TEG element to supply or receive a signal to or from said TEG element.
Dependencies are inferred from the claim text.