Methods and systems for processing a device, methods and systems for modeling same and the device

A system of laser processing a multi-level, multi-material device including a substrate, a microstructure and a multi-layer stack, the stack having inner layers which separate the microstructure from the substrate, the system comprising:

• means for generating a pulsed laser beam having a predetermined wavelength and including at least one laser pulse having a predetermined characteristic comprising at least one of a temporal shape and spatial shape;
• means for relatively positioning the microstructure and a waist of the laser beam in three-dimensional space based on at least a position measurement obtained at a reference location wherein the position measurement is used to obtain a prediction of a common location of the microstructure and the beam waist;
• and
• means for irradiating the microstructure with the at least one laser pulse based on the predicted common location at a time wherein the beam waist and the microstructure substantially coincide, wherein the microstructure is cleanly removed with substantially maximum pulse energy density at the microstructure and wherein an undesirable change to the inner layers of the stack and substrate is avoided.

A method for modeling interactions of a pulsed laser beam including at least one laser pulse with a three-dimensional device including a substrate, a predetermined microstructure formed on the substrate and a plurality of other structures formed on the substrate, the method comprising:

• providing information regarding material of the structures including the predetermined microstructure and the substrate;
• determining optical propagation characteristics of at least a portion of the laser beam not absorbed by the predetermined microstructure based on the information;
• and
• determining at least one characteristic of the at least one pulse based on the optical propagation characteristics.

A system for modeling interactions of a pulsed laser beam including at least one laser pulse with a three-dimensional device including a substrate, a predetermined microstructure formed on the substrate and a plurality of other structures formed on the substrate, the system comprising:

• means for providing information regarding material of the structures including the predetermined microstructure and the substrate;
• means for determining optical propagation characteristics of at least a portion of the laser beam not absorbed by the predetermined microstructure based on the information;
• and
• means for determining at least one characteristic of the at least one pulse based on the optical propagation characteristics.

A method for modeling interactions of a pulsed laser beam including at least one laser pulse with a three-dimensional device including a substrate, a predetermined microstructure formed on the substrate and a plurality of other structures formed on the substrate, the method comprising:

• providing information regarding material and spacing of the structures including the predetermined microstructure and the substrate;
• determining optical propagation characteristics of at least a portion of the laser beam not absorbed by the predetermined microstructure based on the information;
• and
• determining at least one characteristic of the at least one pulse which avoids undesirable changes in electrical or physical characteristics of the substrate and the other structures based on the optical propagation characteristics.

A system for modeling interactions of a pulsed laser beam including at least one laser pulse with a three-dimensional device including a substrate, a predetermined microstructure formed on the substrate and a plurality of other structures formed on the substrate, the system comprising:

• means for providing information regarding material and spacing of the structures including the predetermined microstructure and the substrate;
• means for determining optical propagation characteristics of at least a portion of the laser beam not absorbed by the predetermined microstructure based on the information;
• and
• means for determining at least one characteristic of the at least one pulse which avoids undesirable changes in electrical or physical characteristics of the substrate and the other structures based on the optical propagation characteristics.

A method of laser processing a multi-level, multi-material device including a substrate, a microstructure and a multi-layer stack, the stack having inner layers which separate the microstructure from the substrate, the method comprising:

• generating a pulsed laser beam having a predetermined wavelength and including at least one laser pulse having a predetermined characteristic wherein:
• a) the predetermined wavelength is below an absorption edge of the substrate;
• and
• b) wherein the at least one pulse has duration less than about 10 nanoseconds, and a repetition rate of 10 KHz or higher;
• relatively positioning the microstructure and a waist of the laser beam in three-dimensional space based on at least a position measurement obtained at a reference location wherein the position measurement is used to obtain a prediction of a common location of the microstructure and the beam waist;
• and
• irradiating the microstructure with the at least one laser pulse based on the predicted common location at a time wherein the beam waist and the microstructure substantially coincide, wherein the microstructure is cleanly removed with substantially maximum pulse energy density at the microstructure and wherein an undesirable change to the inner layers of the stack and substrate is avoided.

A system of laser processing a multi-level, multi-material device including a substrate, a microstructure and a multi-layer stack, the stack having inner layers which separate the microstructure from the substrate, the system comprising:

• means for generating a pulsed laser beam having a predetermined wavelength and including at least one laser pulse having a predetermined characteristic wherein:
• a) the predetermined wavelength is below an absorption edge of the substrate;
• and
• b) wherein the at least one pulse has duration less than about 10 nanoseconds, and a repetition rate of 10 KHz or higher;
• means for relatively positioning the microstructure and a waist of the laser beam in three-dimensional space based on at least a position measurement obtained at a reference location wherein the position measurement is used to obtain a prediction of a common location of the microstructure and the beam waist;
• and
• means for irradiating the microstructure with the at least one laser pulse based on the predicted common location at a time wherein the beam waist and the microstructure substantially coincide, wherein the microstructure is cleanly removed with substantially maximum pulse energy density at the-microstructure and wherein an undesirable change to the inner layers of the stack and substrate is avoided.