Cluster tool with vacuum wafer transfer module

Abstract

A cluster tool for forming semiconductor devices using a wafer process includes: at least a load port where wafers are loaded; a front end system including an ATM robot and an ATM aligner, the front end system positioned under atmospheric pressure in a clean room condition; at least a load lock chamber including at least a vacuum wafer transfer device; at least a process module where the wafer process are conducted on the wafers; and at least a slot valve located between the load lock chamber and the process module; wherein the ATM robot transfers the wafers from the load port to the ATM aligner for a positional aligning and then transfers the positional-aligned wafers to the vacuum wafer transfer device; wherein the ATM aligner aligns the wafers for adequate process in the process module; and wherein the vacuum wafer transfer device includes at least a end effector that supports the wafers transferring by the ATM robot, and then the vacuum transfer device puts the wafers into the process module for the wafer process and takes the processed wafers back from the process module.

Dependencies are inferred from the claim text.