Bladder based package control/singulation
AssigneeMicron Technology, Inc.
InventorDaniel P. Cram
Life of this patent
Estimating the term…
Abstract
An apparatus and method for singulating IC devices or semiconductor devices and/or components thereof. The apparatus includes a flexible membrane or bladder configured to receive an applied fluid pressure on a surface thereof and expand in response to the applied fluid pressure. Upon expansion of the flexible membrane, a semiconductor device or semiconductor device component is contacted by the flexible membrane and immobilized. The semiconductor device may then be subjected to a predetermined test or manufacturing operation. Subsequent any processing to the semiconductor device or component, the fluid pressure is released such that the flexible membrane contracts and releases the semiconductor device to be advanced for further processing, testing, or preparation for shipping.
Claims72
An apparatus for individually handling a plurality of semiconductor devices comprising:
- a first plate having a first opening therethrough;
- a second plate having a first opening therethrough, the first opening of the second plate being substantially aligned with the first opening of the first plate;
- and
- a first flexible membrane disposed between the first and second plates and configured to receive a first applied fluid pressure adjacent the first opening of the first plate and to extend outwardly through the first opening of the second plate to contact and immobilize at least one semiconductor device moving adjacent thereto.
An apparatus for individually handling IC components comprising:
- a first flexible membrane configured to receive an applied fluid pressure on a surface of the membrane and to expand to contact and immobilize at least one IC component moving adjacent thereto.
An apparatus for handling one or more IC devices comprising:
- a first flexible membrane configured to receive an applied fluid pressure on a surface of the membrane and to expand to contact and immobilize at least one IC device moving adjacent thereto.
A handler for IC devices comprising:
- an input location for receiving a plurality of IC devices;
- a pathway along which the IC devices are advanced from the input location;
- and
- at least one flexible membrane configured to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement of the at least one IC device.
An apparatus for singulation of semiconductor devices comprising:
- a first plate having a first opening therethrough;
- a second plate having a first opening therethrough, the first opening of the second plate being substantially aligned with the first opening of the first plate;
- and
- a first flexible membrane disposed between the first and second plates and configured to receive a first applied fluid pressure adjacent the first opening of the first plate and to extend outwardly through the first opening of the second plate to contact and immobilize at least one semiconductor device moving adjacent thereto.
An apparatus for singulation of IC components comprising:
- a first flexible membrane configured to receive an applied fluid pressure on a surface of the membrane and to expand to contact and immobilize at least one IC component moving adjacent thereto.
An apparatus for singulation of IC devices comprising:
- a first flexible membrane configured to receive an applied fluid pressure on a surface of the membrane and to expand to contact and immobilize at least one IC device moving adjacent thereto.
An automated handler for IC devices comprising:
- an input location for receiving a plurality of IC devices;
- a pathway along which the IC devices are advanced from the input location;
- and
- at least one flexible membrane configured to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement of the at least one IC device.
A method of singulating IC devices comprising:
- advancing a plurality of IC devices along a predetermined path;
- providing at least one flexible membrane adjacent the path;
- applying a fluid pressure to a surface of the at least one membrane such that the at least one membrane extends towards the path;
- contacting at least one of the plurality of IC devices with the at least one membrane and immobilizing the at least one IC device.
A method of testing IC devices comprising:
- advancing a plurality of IC devices along a predetermined pathway;
- providing at least one flexible membrane adjacent the pathway;
- applying a fluid pressure to a surface of the at least one membrane such that the at least one membrane extends towards the pathway;
- contacting at least one of the plurality of IC devices with the membrane and immobilizing the at least one IC device;
- subjecting the IC device to a predetermined test;
- and
- releasing the applied fluid pressure such that the at least one membrane retracts from and releases the at least one IC device.
A method of manufacturing an IC device comprising:
- providing a first IC device component;
- advancing the first IC device component along a predetermined pathway;
- providing a flexible membrane adjacent the pathway;
- applying a fluid pressure to a surface of the membrane such that the membrane extends towards the IC device component;
- contacting the IC device with the membrane to halt the advancement of the IC device;
- subjecting the first IC device component to a predetermined manufacturing operation;
- and
- releasing the applied fluid pressure such that the membrane retracts from the first IC device component.
Dependencies are inferred from the claim text.