Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies
OwnerNael Hannan, Viswamadham Puligandla +2inventors
InventorsNael Hannan, Viswamadham Puligandla, Steven Dunford, Pekka Rautila
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Abstract
Surface mount packages having pre-applied underfill thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.
Claims47
A surface mount package, comprising:
- an electronic component having a first side and a second side, the first side including a plurality of electrical contacts thereon;
- and
- underfill material applied along at least a portion of the first side of the electronic component prior to shipping.
A surface mount package, comprising:
- an electronic component having a first side and a second side, the first side including a plurality of electrical contacts thereon;
- and
- a first underfill material applied along at least a portion of a perimeter of the first side prior to shipping.
A surface mount package, comprising:
- an electronic component having a plurality of leads extending from a body of the electronic component;
- and
- a first underfill applied to at least one of the plurality of leads, the first underfill material being applied prior to shipping of the package.
A method for fabricating a surface mount package, comprising:
- employing an electronic component having a first side and a second side;
- disposing attachment material to the first side;
- and
- applying a first underfill material to the first side of the electronic component, the first underfill material being applied prior to shipment of the package.
A method for applying a film underfill to a surface mount package, comprising:
- positioning the film underfill on the surface mount package;
- attaching the film underfill to the surface mount package such that the area between the film underfill and the surface mount package is substantially free of air;
- cutting the film underfill to a size corresponding to a size of the surface mount package;
- and
- shipping the surface mount package with the film underfill applied thereon.
A method for connecting a surface mount package with a substrate, comprising:
- employing a surface mount package with pre-applied underfill thereon;
- aligning attachment material of the surface mount package with electrical terminations of the substrate;
- and
- applying heat to the surface mount package and the substrate, such that the heat facilitates connection of the attachment material with the electrical terminations.
A surface mount package, comprising:
- an electronic component having a plurality of electrical contacts thereon;
- and
- a pre-applied underfill material forming a wall along at least a portion of a perimeter of the package, the underfill material upon curing partly compensating for thermal mismatch between the package and a substrate.
A surface mount package, comprising:
- means for providing an electrical connection between the surface mount package and a surface;
- and
- means for compensating for thermal mismatch between the surface mount package and the substrate, the means for compensating being part of the package prior to shipping.
Dependencies are inferred from the claim text.