Electronic apparatus

An electronic apparatus provided with an electronic circuit substrate comprising:

• an electronic circuit substrate mounting a heat generating component, a case for protectively housing said electronic circuit substrate and provided with an opening for housing said electronic circuit substrate, and a cover for blocking said opening of said case wherein,
• said electronic circuit substrate comprises a resin circuit board formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes formed directly below a portion where said heat generating component is mounted and which are not connected to said grounding pattern, an insulating groove comprising a concave groove formed in a front surface of said substrate mounting said heat generating component so as to surround said heat generating component, and an insulating groove also comprising a concave groove being formed in a rear surface of said substrate at a location opposite that of said groove in said substrate front surface,
• said case comprising a heat dissipating protruding surface portion contacting an area where said through holes of said rear surface of said electronic circuit substrate are disposed, and formed so as to ensure a space between portions of said case other than said protruding surface portion and said rear surface of said electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components to said rear surface of said electronic circuit substrate.

An electronic apparatus comprising:

• an electronic circuit substrate having mounted on a surface thereof a first non-encapsulated heat generating electronic component and a case for housing said electronic circuit substrate;
• wherein said electronic circuit substrate has a plurality of through holes disposed directly below said first non-encapsulated heat generating electronic component, and thermally connected to said first non-encapsulated heat generating electronic component;
• said first electronic circuit substrate has a grounding pattern thermally connected to said through holes;
• and wherein said case has a protruding portion disposed in contact with a rear surface portion of said electronic circuit substrate directly below said first non-encapsulated heat generating electronic component and thermally connected to said through holes.

An electronic apparatus comprising:

• an electronic circuit substrate having mounted on a surf ace there of a first heat generating electronic component;
• and a case for housing said electronic circuit substrate;
• wherein said electronic circuit substrate has a plurality of through holes disposed directly below said first heat generating electronic component, and thermally connected to said first heat generating electronic component;
• said electronic circuit substrate has a plurality of grounding patterns of mutually different shapes thermally connected to said through holes;
• and wherein said case has a protruding portion disposed in contact with a rear surface portion of said electronic circuit substrate directly below said first heat generating electronic component and thermally connected to said through holes.

An electronic apparatus comprising:

• an electronic circuit substrate having mounted on a surface thereof a first heat generating electronic component and a case for housing said electronic circuit substrate;
• wherein said electronic circuit substrate ha s a plurality of through holes disposed directly below said first heat generating electronic component, and thermally connected to said first heat generating electronic component;
• said electronic circuit substrate has a grounding pattern thermally connected to said through holes;
• said case has a protruding portion disposed in contact with a rear surface portion of said electronic circuit substrate directly below said first heat generating electronic component and thermally connected to said through holes;
• said protruding portion having a prismoid shape composed of a level portion and an inclined portion;
• said through holes having positioned within the horizontal projection of said level portion of said protruding portion;
• and
• said first electronic component being formed to extend beyond said level portion.

An electronic apparatus comprising:

• an electronic circuit substrate having mounted on a surface thereof a first heat generating electronic component, a second electronic component and a case for housing said electronic circuit substrate;
• wherein said case has a protruding portion disposed in contact with a rear surface portion of said electronic circuit substrate directly below said first heat generating electronic component and thermally connected to said electronic circuit substrate;
• said protruding portion having a prismoid shape composed of a level portion and an inclined portion;
• and
• said second electronic component being mounted on a rear surface of said electronic circuit substrate, opposite said inclined portion.

An electronic apparatus comprising:

• an electronic circuit substrate having mounted on a surface thereof a first heat generating electronic component and a case for housing the electronic circuit substrate;
• wherein said electronic circuit substrate has a plurality of through holes disposed directly below said first heat generating electronic component, and thermally connected to said first heat generating electronic component;
• said electronic circuit substrate has a grounding pattern thermally connected to said through holes;
• said case has a protruding portion disposed in contact with a rear surface portion of said electronic circuit substrate directly below said first heat generating electronic component and thermally connected to said through holes;
• and wherein a heat dissipating grease is disposed in a continuous manner between said first electronic components and said electronic circuit substrate, within said through holes, and between said electronic circuit substrate and said protruding portion.