Heat sink device manufacture

Abstract

A method for manufacturing a cooling device. The cooling device may be used to cool an integrated circuit. The method is broadly summarized by the following steps: pressing a metal slug to near-net shape, wherein the near-net shape includes a peripheral wall portion defining a chamber, the chamber having a first open end and a second closed end, the closed end defined by a chamber floor portion, and wherein the near-net shape includes a heat conductive base portion, the heat conductive base portion being defined by a lower base surface and the chamber floor portion; machining the lower base surface; creating a radius on the top of the peripheral wall portion; and cutting a plurality of slot openings in the peripheral wall portion.

Dependencies are inferred from the claim text.