Substrate adhesion enhancement to film
AssigneeOak-Mitsui, Inc.
InventorsEdward C. Skorupski, Jeffrey T. Gray, John A. Andresakis, Wendy Herrick
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Abstract
The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
Claims34
A process for forming a printed circuit board composite comprising:
- a) etching at least one of two opposite surfaces of a planar polymeric substrate;
- b) attaching a polymeric film onto one or both etched surfaces of the polymeric substrate;
- and
- c) laminating and attaching a metal foil onto the polymeric film.
A process for forming a printed circuit board comprising:
- a) etching at least one of two opposite surfaces of a planar polymeric substrate;
- b) attaching a polymeric film onto one or both etched surfaces of the polymeric substrate;
- c) laminating and attaching a metal foil onto the polymeric film;
- d) depositing a photoresist onto the metal foil;
- e) exposing and developing the photoresist, thereby revealing underlying portions of the metal foil;
- and
- f) removing the revealed underlying portions of the metal foil.
Dependencies are inferred from the claim text.