Apparatus for placing a semiconductor chip as a flipchip on a substrate
AssigneeESEC Trading SA, a Swiss Corporation
InventorsDominik Hartmann, Ruedi Grueter
Life of this patent
Estimating the term…
Abstract
An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
Claims20
Apparatus for placing a semiconductor chip as a flipchip on a substrate, comprising
- a flip device for flipping the semiconductor chip, the flip device being formed as a parallelogram construction consisting of a support bracket, a first and a second swivel arm and a connecting arm and comprising a chip gripper arranged on the connecting arm, and
- a drive system for the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
Dependencies are inferred from the claim text.