Method and apparatus for inspecting a substrate
AssigneeKLA-Tencor Corporation
InventorsDavid Adler, Kirk Bertsche, Mark McCord, Stuart Friedman
Life of this patent
Estimating the term…
Abstract
A method and apparatus for inspection and review of defects is disclosed wherein data gathering is improved. In one embodiment, multiple or segmented detectors are used in a particle beam system.
Claims48
A method of inspecting and/or characterizing a substrate, comprising:
- obtaining a first dataset, wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said first detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said second detector of at least a portion of said second region of said substrate;
- and
- processing information derived from said first, second, third, and fourth datasets to determine whether a defect exists in at least one of said first or second regions.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate, and wherein said region includes an array of substantially identical repeating features;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- and
- processing information derived from at least said first dataset to determine whether differences exist between a first portion of said repeating features and a second portion of said repeating features.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate, and wherein said region includes an array of substantially identical repeating features;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- and
- processing information derived from at least said first dataset to identify a nonrepeating portion within said array.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate, and wherein said region includes an array of substantially identical repeating features;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said first detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said second detector of at least portion of said second region of said substrate;
- and
- obtaining a fifth dataset, wherein said fifth dataset includes data derived from an image collected by said first detector from a third region of said substrate, wherein said third region of said substrate is expected to be substantially identical to said first and second regions;
- and
- using said fifth dataset to assist in arbitrating which of said first and second regions contains a defect.
A method of redetecting a defect which was detected during a previous inspection of a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset, wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate, and wherein said first region is known to contain a defect found during a previous inspection;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said first detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said second detector of at least a portion of said second region of said substrate;
- and
- processing information derived from said first, second, third, and fourth datasets to redetect said previously found defect in said first region.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate, and wherein said region includes an array of substantially identical repeating features;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- and
- combining analog information within said first and second datasets.
A method of inspecting an object, comprising:
- exposing at least a portion of said object to a beam of charged particles;
- and
- detecting particles from portion of said object using at least two detectors, wherein at least one of said detectors detects a multipixel image.
A method of inspecting and/or characterizing a substrate, wherein said substrate is selected from the group consisting of semiconductor wafers, singulated die, package substrates, reticles and photomasks, the method comprising:
- exposing said substrate to at least a first source of charged particles:
- detecting charged particles emitted from said substrate with at least two detectors, wherein said substrate is moved continuously relative to said source of charged particles during said exposure step.
A method of inspecting and/or characterizing a substrate, comprising:
- obtaining a first dataset, wherein said first dataset includes data derived from an image collected by a first electron detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second electron detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said first electron detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said second electron detector of at least a portion of said second region of said substrate;
- processing information derived from said first, second, third, and fourth datasets to determine whether a defect exists in at least one of said first or second regions;
- obtain a fifth dataset, wherein said fifth dataset includes data derived from an image collected by an X-ray detector of at least a portion of said first region and/or said second region of said substrate;
- and
- processing materials from said fifth dataset to identify the materials in the defective and non-defective areas of said first region and/or said second region.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, comprising:
- obtaining a first dataset, wherein said first dataset includes data derived from an image collected by an electron detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by an X-ray detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said electron detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said X-ray detector of at least a portion of said second region of said substrate;
- and
- processing information derived from said first, second, third, and fourth datasets to determine whether a defect exists in at least one of said first or second regions.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by an X-ray detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by said X-ray detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said X-ray detector from a third region of said substrate, wherein said third region of said substrate is expected to be substantially identical to said first and second regions;
- and
- using said third dataset to assist in arbitrating which of said first and second regions contains a defect.
A method of inspecting and/or characterizing a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- generating an image of said first region based on the substrate designer's database;
- and
- comparing the image data from said first detector and said second detector with the image based on the substrate designer's database to identify defects in said first region.
A method of classifying defects on a substrate, wherein said substrate includes a plurality of substantially identical features, the method comprising:
- obtaining a first dataset, wherein said first dataset includes data derived from an image collected by a first detector of a first region of said substrate;
- obtaining a second dataset, wherein said second dataset includes data derived from an image collected by a second detector of at least a portion of said first region of said substrate;
- obtaining a third dataset, wherein said third dataset includes data derived from an image collected by said first detector from a second region of said substrate, wherein said second region of said substrate is expected to be substantially identical to said first region;
- obtaining a fourth dataset, wherein said fourth dataset includes data derived from an image collected by said second detector of at least a portion of said second region of said substrate;
- and
- processing information derived from said first, second, third, and fourth datasets to calculate a composite difference signal, and
- identifying and classifying the defects on the basis of the composite difference signal.
A method of inspecting a substrate wherein said substrate includes a plurality of substantially identical features, the method comprising:
- exposing a portion of said substrate to a particle beam
- obtaining a dataset which includes data derived from an image collected by a detector of a region of said substrate, said region containing a plurality of substantially identical features;
- and
- processing the dataset to determine whether differences exist between a first portion of said repeating features and a second portion of said repeating features.
A method of inspecting and/or characterizing a substrate with an electron-beam inspection system that contains two or more detectors, comprising filtering backscattered electrons to substantially prevent said backscattered electrons form reaching at least one of said detectors.
A method of inspecting and/or characterizing a substrate with an electron-beam inspection system that contains two or more detectors, comprising using a dispersive element to cause low-energy electrons to strike one detector and high-energy electrons to strike another detector.
A method of inspecting or reviewing a substrate, comprising:
- a. exposing at least a portion of said substrate, thereby causing said substrate to emit charged particles;
- b. detecting said charged particles with a first detector element;
- c. detecting said charged particles with a second detector element;
- and
- d. combining signals from said first detector element and said second detector element, such that topographical data concerning said substrate is enhanced.
Dependencies are inferred from the claim text.