Damping resin composition and damping resin article for structure using the resin composition

Abstract

A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2═CR2CO—(R1O)n—OCOCR2═CH2  (1) where n is integer that is equal to or greater than 2, R1 is an alkylene or polymethylene chain having 2 to 13 carbon atoms, and R2 is hydrogen or a methyl group. Also provided is a damping resin article for a structure that is formed from the above damping resin composition by various molding methods.

Dependencies are inferred from the claim text.