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US 2002/0161100 A1Published application
Embedding resin, wiring substrate using same and process for producing wiring substrate using same
AssigneeNgk Spark Plug Co., Ltd.
InventorsTosifumi Kojima, Hiroki Takeuchi, Kazushige Obayashi
Life of this patent
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Abstract
An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.
Claims9
An embedding resin for embedding an electronic part in a wiring substrate, which comprises at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.
A process for producing a wiring substrate which comprises:
- a mounting step of disposing an electronic part in an opening provided in a substrate;
- an embedding step of filling a gap in the opening in which the electronic part has been disposed, with an embedding resin comprising at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent;
- a roughening step of dissolving the at least one of the soluble resin and the soluble inorganic filler contained in the embedding resin with an oxidizing agent to form an eluted portion, forming a roughened surface on the exposed surface or the embedding resin;
- and
- a wiring forming step of forming a wiring on the roughened surface.
2 more elements
Dependencies are inferred from the claim text.