Method for manufacturing aluminum nitride sintered body in which via hole is made
AssigneeTokuyama Corporation
InventorsReo Yamamoto, Yoshihide Kamiyama
Life of this patent
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Abstract
A sintered aluminum nitride having satisfactorily densified via holes, which is free from cracking and has excellent appearance, is produced through firing an aluminum nitride molding having at least one highly isolated through-hole for via hole formation. At least one through-hole for formation of dummy via holes not used for electrical connection is formed around the highly isolated through-hole for via hole formation, and the through-hole for dummy via hole formation is also filled with a conductive paste. Thereafter, the aluminum nitride molding is fired into the sintered aluminum nitride.
Claims8
A process for producing a sintered aluminum nitride furnished with via holes, comprising providing an aluminum nitride molding having through-holes for via hole formation and through-holes for formation of dummy via holes not used for electrical connection, filling the through-holes for via hole formation and the through-holes for dummy via hole formation with a conductive paste and firing the aluminum nitride molding and conductive paste,
- wherein the aluminum nitride molding is furnished with the through-holes for via hole formation and the through-holes for dummy via hole formation so that the through-holes for via hole formation having been filled with the conductive paste and the aluminum nitride molding respectively exhibit a firing shrinkage factor (Xv, %) and a firing shrinkage factor (Xs, %) whose difference, Xv−Xs, is in the range of −1.0 to 9.5%.
A process for producing a sintered aluminum nitride furnished with via holes, comprising providing an aluminum nitride molding having through-holes for via hole formation and through-holes for formation of dummy via holes not used for electrical connection, filling the through-holes for via hole formation and the through-holes for dummy via hole formation with a conductive paste and firing the aluminum nitride molding and conductive paste,
- wherein at least one of the through-holes for via hole formation is in such a highly isolated state that, therearound, other through-holes for via hole formation are not densely present, and wherein at least one of the through-holes for dummy via hole formation is formed around the through-hole for via hole formation of said highly isolated state.
Dependencies are inferred from the claim text.