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AssigneeShin-Etsu Handotai Co., Ltd.
InventorsTakashi Nihonmatsu, Takahiro Kida, Tadao Tanaka
Estimating the term…
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer.
A wafer adhering method for adhering a wafer to a wafer holding plate in order to polish a surface to be polished of the-wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the method comprising the steps of:
A wafer adhering apparatus in which a wafer is held by-vacuum-chucking a surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, the region being at least not less than 50% of an entire adhesion area.
A wafer holding plate comprising:
A wafer holding plate comprising:
A wafer holding plate used for a batch processing polishing apparatus, comprising a wafer holding portion being turnable with respect to a base body.
Dependencies are inferred from the claim text.