Capacitor for analog circuit, and manufacturing method thereof

Abstract

Rapid thermal nitridation is carried out to form a nitride film (19) on a lower electrode (15) which is made of silicon, and a tantalum oxide dielectric film (23) is further formed thereon. Then, wet oxidization is carried out to oxidize the lower electrode through the dielectric film (23) and the nitride film (19), thus an oxide film (17) is formed between the lower electrode (15) and the nitride film (19). Further, silicon which is not bonded to nitrogen in the nitride film (19) is oxidized, thus an oxide film (21) whose effective thickness is equal to or greater than 2 nm. The oxidization also recrystallizes the dielectric film (23). Finally, an upper electrode (25) is formed, and the capacitor is completed.

Dependencies are inferred from the claim text.