Terminal land frame and method for manufacturing the same

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) preparing a terminal land frame, the terminal land frame including:
• a frame body;
• a plurality of lands including first and second groups of lands, each said land being substantially as thick as the frame body, at least part of each said land protruding out of the frame body;
• and a plurality of thinned portions, each said thinned portion connecting the frame body to associated one of the lands and being thinner than the frame body or the lands, wherein when each said land is pressed in a direction in which the land protrudes, associated one of the thinned portions is fractured and the land is separable from the frame body;
• b) mounting a semiconductor chip on respective top faces of the protruding parts of the first group of lands;
• c) electrically connecting the lands of the second group to associated electrode pads of the semiconductor chip via a plurality of connection members;
• d) molding the semiconductor chip, the connection members and the upper half of the terminal land frame, including the respective parts of the lands protruding out of the frame body, with a resin encapsulant;
• and
• e) applying force in such a direction as separating the respective members molded with the resin encapsulant, including the lands, from the frame body, thereby separating a resin-molded semiconductor device, in which respective lower halves of the lands other than the protruding parts thereof are not covered with the resin encapsulant but protrude down-ward from the lower surface of the resin encapsulant, from the frame body.

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) preparing a terminal land frame, the terminal land frame including:
• a metallic frame body;
• a die pad being substantially as thick as the frame body and including a first part protruding out of the frame body;
• a plurality of lands, each said land being substantially as thick as the frame body and including a second part protruding out of the frame body;
• a first thinned portion connecting the frame body and the die pad together and being thinner than the frame body or the die pad;
• and a plurality of second thinned portions, each said second thinned portion connecting the frame body to associated one of the lands and being thinner than the frame body or the lands;
• b) mounting a semiconductor chip on the top face of the protruding first part of the die pad;
• c) electrically connecting the lands to associated electrode pads of the semiconductor chip via a plurality of connection members;
• d) molding the semiconductor chip, the connection members and the upper half of the terminal land frame, including the first part of the die pad and the second parts of the lands, with a resin encapsulant;
• and
• e) applying force in such a direction as separating the respective members molded with the resin encapsulant, including the die pad and the lands, from the frame body, thereby separating a resin-molded semiconductor device, in which a first lower half, which is the remaining portion of the die pad other than the first part, and second lower halves, each of which is the remaining portion of associated one of the lands other than associated one of the second parts, are not covered with the resin encapsulant but protrude downward from the lower surface of the resin encapsulant, from the frame body.

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) preparing a terminal land frame, the terminal land frame including:
• a metallic frame body;
• a plurality of lands, each said land being substantially as thick as the frame body, at least part of each said land protruding out of the frame body;
• and a plurality of thinned portions, each said thinned portion connecting the frame body to associated one of the lands and being thinner than the frame body or the lands, wherein when each said land is pressed in a direction in which the land protrudes, associated one of the thinned portions is fractured and the land is separable from the frame body;
• b) mounting a semiconductor chip on respective top faces of the protruding parts of the lands, thereby electrically connecting the lands to associated electrode pads of the semiconductor chip;
• c) molding the semiconductor chip and the upper half of the terminal land frame, including the respective parts of the lands protruding out of the frame body, with a resin encapsulant;
• and
• d) applying force in such a direction as separating the respective members molded with the resin encapsulant, including the lands, from the frame body, thereby separating a resin-molded semiconductor device, in which respective lower halves of the lands other than the protruding parts thereof are not covered with the resin encapsulant but protrude down-ward from the lower surface of the resin encapsulant, from the frame body.