Manufacturing method for organic EL display, disposing method for semiconductor element, manufacturing method for semiconductor device, manufacturing method for electro-optic device, electro-optic device, and electronic device

A disposing method for a semiconductor element in which a unit block having a semiconductor element is disposed at a predetermined position on a base board,

• the disposing method for a semiconductor element characterized in that by arranging a hole which penetrates in the thickness direction through a display base board at a predetermined position of the display base board, and by making the pressure at one face of the display base board higher than the pressure at the other face, or by drawing the liquid into said hole so as to introduce unit block at the position of said hole on one surface of display base board.

A disposing method for a semiconductor element in which a unit block having a semiconductor element is disposed at a predetermined position on a base board,

• disposing method for a semiconductor element characterized in that the unit block is introduced at a predetermined position on the base board by Coulomb attractive force.

A manufacturing method for a semiconductor device in which a unit block having semiconductor element is disposed at a predetermined position on a base board,

• the manufacturing method for a semiconductor device wherein the wiring which is formed on a base board being formed by an ink jet method.

A manufacturing method for a semiconductor device having a process in which a unit block having semiconductor element is disposed at a predetermined position on a base board,

• the manufacturing method for a semiconductor device the wiring and terminals for connecting with wiring inside the unit block of this wiring being formed on a base board in advance, in the unit block, at a position which contacts terminals on the base board at the time of disposing on the base board, after the terminal for connecting with the wiring on the base board being formed in advance in the unit block, and the unit block being disposed at a predetermined position on the base board.

A manufacturing method for a semiconductor device having process in which a unit block having plural semiconductor elements is disposed at a predetermined position of the base board,

• the manufacturing method for a semiconductor device which disposes plural terminals for each semiconductor element such that the planar shape of the unit block is polygonal, and the rotation symmetricalness is centered by the center of this polygon.

A manufacturing method for a semiconductor device having a process in which a unit block having plural semiconductor elements is disposed at a predetermined position on a base board,

• the manufacturing method for a semiconductor device in which plural terminals for each semiconductor element are disposed such that plan view of the unit block is made rectangular, and plural terminals for each organic EL elements are disposed so as to be axisymmetric relative to both center lines which are parallel with the longer side of the rectangle and center line which is parallel to the shorter side of the rectangle.

A manufacturing method for a semiconductor device having a process in which a unit block having plural semiconductor elements is disposed at a predetermined position on a base board,

• the manufacturing method for a semiconductor device the plan view of unit block being polygonal, and plural terminals for each semiconductor element being disposed along each diagonal line of this polygon, and the position of the terminals on each diagonal line being such that the same terminal is on the same previous position after the rotation.

A manufacturing method for an active-matrix type organic EL display a light emitting layer which is inserted among at least two pieces of electrode per pixel and said light emitting layer being driven by a semiconductor element,

• the manufacturing method for an active-matrix type organic EL display characterized in that the semiconductor element is formed on a base board, said semiconductor element is detached from the base board so as to be divided per unit blocks, said unit blocks of said semiconductor element is disposed on other base board.

A manufacturing method for an electro-optic device which is provided with an electro-optic element and a semiconductor element which drives this electro-optic element on a display base board,

• the manufacturing method for electro-optic device comprising a process which disposes a unit block having said semiconductor element at a predetermined position of the display base board.

An electro-optic device which is provided with an electro-optic element and a semiconductor element which drives this electro-optic element on a display base board,

• the electro-optic device characterized in that a unit block which is provided with driving circuit having said semiconductor element is disposed at a predetermined position on the display base board.