Electronic component and method for forming substrate electrode of the same
AssigneeMurata Manufacturing Co., Ltd.
InventorHiroaki Kaida
Life of this patent
Estimating the term…
Abstract
An electronic component includes a case substrate. Substrate electrodes having a substantially spherical outer surface are disposed on at least a first principal surface of the case substrate. A piezoelectric resonator is mounted on the case substrate such that the piezoelectric resonator is bonded to the outer surfaces of the substrate electrodes by a conductive bonding material and is supported by the substrate electrodes in a point-contact manner. Also, the formula, Lk−2We<Lp<Lk−We, is satisfied where Lp is the length of the piezoelectric resonator, Lk is the length of the case substrate, and We is the length of the substrate electrode.
Claims19
An electronic component comprising:
- a case substrate having first and second principal surfaces facing each other;
- a plurality of substrate electrodes disposed on at least the first principal surface, each substrate electrode having a substantially spherical outer surface;
- an electronic component element, which is mounted on the first principal surface with a space therebetween and which is supported by the plurality of substrate electrodes in a point-contact manner;
- and
- a conductive bonding material bonding the electronic component element to the plurality of substrate electrodes.
A method for manufacturing an electronic component, comprising steps of:
- preparing a case substrate having first and second principal surfaces facing each other and a transfer plate made of a flexible material and having a plurality of grooves which extend in one direction and which are filled with a conductive paste;
- applying the conductive paste to at least the first principal surface by pressing the first principal surface into contact with one surface of the transfer plate and then removing the transfer plate;
- forming a plurality of substrate electrodes, each having a substantially spherical outer surface, on the first principal surface of the case substrate by baking the conductive paste;
- mounting an electronic component element on the case substrate provided with the substrate electrodes such that the electronic component element is spaced from the first principal surface and is supported by the plurality of substrate electrodes in a point-contact manner;
- and
- bonding the substrate electrodes of the case substrate to the electronic component element using a conductive bonding material.
Dependencies are inferred from the claim text.