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OwnerAkira Nagai, Shuji Eguchi +13inventors
InventorsAkira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii, Nobutake Tsuyuno, Hiroyoshi Kokaku, Rie Hattori, Makoto Morishima, Ichiro Anjoh, Kunihiro Tsubosaki, Chuichi Miyazaki, Makoto Kitano, Mamoru Mita, Norio Okabe
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A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).
A circuit tape with an adhesive layer, for semiconductor devices, comprising:
A circuit tape with an adhesive layer, for semiconductor devices, comprising:
A method of manufacturing a circuit tape with an adhesive layer, for semiconductor devices, comprising the steps of:
Adhesive film for semiconductor devices, which is for adhering a semiconductor element to circuit tape, having an elastic modulus, in a range of mounting reflow temperature for mounting the semiconductor element onto a mounting substrate, of more than 1 MPa.
Dependencies are inferred from the claim text.