Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
AssigneeSony Corporation
InventorYoshinari Matsuda
Life of this patent
Estimating the term…
Abstract
Copper foil lands provided with a through-hole to be filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands would hitherto easily occur, whereby a copper plated-through hole both side printed wiring board using a paper-phenol substrate is obtained in which adhesion strength between the copper foil lands and the copper paste has been enhanced.
Claims10
A printed wiring board formed by using a both side metallic foil clad laminate comprising a paper substrate, wherein
- metallic foil lands provided on both sides of said paper substrate and provided with a through-hole to be filled with a conductive paste are each provided with a metallic foil removed portion of a predetermined shape in contact with at least a portion of said through-hole.
A method of manufacturing a printed wiring board formed by using a both side metallic foil clad laminate comprising a paper substrate, comprising the steps of:
- forming metallic foil lands on both sides of said both side metallic foil clad laminate;
- providing each of said metallic foil lands with a metallic foil removed portion of a predetermined shape;
- forming a through-hole in said metallic foil lands;
- and
- filling said through-hole with a conductive paste and drying and curing said filled conductive paste.
Dependencies are inferred from the claim text.