Deposition chamber and method for depositing low dielectric constant films

A deposition chamber assembly comprising:

• a housing defining a chamber;
• a substrate support having a substrate support surface within the chamber;
• a first gas distributor having first exits opening into the chamber around said substrate support surface;
• a second gas distributor having a second exit spaced apart from and generally overlying the central region of said substrate support surface;
• and
• an oxygen-supplying gas distributor having a third exit opening into said vacuum chamber at a position generally centrally above said substrate support surface.

A method for depositing a film onto a substrate within a deposition chamber comprising the steps of:

• injecting a first process gas into the chamber at a plurality of positions surrounding a substrate within the chamber;
• injecting a second process gas into the chamber at a first region spaced apart from and located generally centrally above the substrate;
• and
• injecting an oxygen-supplying gas into the chamber at second region spaced apart from and located generally centrally above said substrate.

A method for depositing a film onto a substrate within a deposition chamber comprising the steps of:

• injecting a first process gas into the chamber at a plurality of positions surrounding a substrate within the chamber;
• injecting a second process gas into the chamber at a first region spaced apart from and located generally opposite the substrate;
• and
• injecting a third process gas into the chamber at a second region generally circumscribing said first region and spaced apart from and located opposite said substrate.