A method of processing microelectronic devices in a tray stack having a plurality of individual trays carrying the microelectronic devices, the tray stack having a first exterior tray at one end of the tray stack and a second exterior tray at an opposite end of the tray, stack, the method comprising:
- inserting the tray stack along a load/unload path into a casing of a tray retaining device until the first exterior tray contacts a cross-member of the retaining device, the casing being configured to restrict the individual trays from moving laterally with respect to the load/unload path;
- moving a retaining element attached to the tray retaining device from a load/unload position to a storage position, the retaining element allowing the tray stack to move along the load/unload path in the load/unload position and the retaining element engaging the second exterior tray in the storage position to restrict movement of the tray stack along the load/unload path;
- releasably attaching the tray retaining device to the receiving station of the processing machine;
- releasing the tray stack to move along the load/unload path by moving the retaining element from the storage position to the load/unload position to disengage the retaining element from the second exterior tray of the tray stack;
- and
- separating individual trays from the tray stack and processing the microelectronic devices on the individual trays in the processing machine.