Optical and electrical interconnect
AssigneeIntel Corporation
InventorsJonathan McFarland, Kannan Raj
Life of this patent
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AssigneeIntel Corporation
InventorsJonathan McFarland, Kannan Raj
Estimating the term…
An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.
An interconnect comprising:
A method of fabricating an interconnect, the method comprising:
An electronic package comprising:
Dependencies are inferred from the claim text.