US 2002/0159243 A1Published application

Wiring board

AssigneeNgk Spark Plug Co., Ltd.

InventorsKouki Ogawa, Yasuhiro Sugimoto

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Abstract

A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board 100 mounting the chip capacitors 160 on a reverse face 101c-side comprises bumps 129 capable of being connected to IC chip 10, first and second capacitor connecting pads 149p, 149g connecting the upper face parts 163 of the chip capacitors 160, a plurality of insulating layers 121, 111, 141 intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers 146p, 146g in stripe pattern formed at interlayer 152, connected to the bumps 129 at the principal face 101b-side, connected to the first capacitor connecting pads 149p at the reverse face 101c-side or the second capacitor connecting pads 149g for changing the connecting positions or the connecting number between the principal face side and the reverse face side.

Claims16

Dependent claims

A wiring board having a principal face and a reverse face, which comprises:

i) a plurality of principal-face-side connecting terminals formed on the principal face side, wherein the principal-face-side connecting terminals are capable of being connected to terminals, respectively, of an electronic part to be mounted on the principal face side;
ii) at least one chip capacitor having a first electrode and a second electrode, wherein the chip capacitor is mounted on the reverse face side, and comprises:
a first face facing to the reverse face;
at least one first terminal that is formed on the first face and connected to the first electrode;
and
at least one second terminal that is formed on the first face and connected to the second electrode;
iii) at least one first capacitor-connecting terminal formed on the reverse face side, wherein the first capacitor-connecting terminal is connected to the first terminal;
iv) at least one second capacitor-connecting terminal formed on the reverse face side, wherein the second capacitor-connecting terminal is connected to the second terminal;
v) a plurality of insulating layers interposed between the principal-face-side connecting terminals, and the at least one first capacitor-connecting terminal and the at least one second capacitor-connecting terminal disposed on the reverse side;
vi) at least one first converting-conductor layer formed at an interlayer between adjacent two insulating layers, wherein the first converting-conductor layer is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is electrically connected to at least one of the first capacitor-connecting terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side;
and
vii) at least one second converting-conductor layer formed at the interlayer, wherein the second converting-conductor layer is insulated from the first converting-conductor layer, is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is electrically connected to at least one of the second capacitor-connecting terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side.

9 more elements

A wiring board having a principal face and a reverse face, which comprises:

i) a plurality of principal-face-side connecting terminals formed on the principal face side, wherein the principal-face-side connecting terminals are capable of being connected to terminals, respectively, of an electronic part to be mounted on the principal face side;
ii) at least one chip capacitor having a first electrode and a second electrode, wherein the chip capacitor is mounted on the reverse face side, and comprises:
a first face facing to the reverse face;
at least one first terminal that is formed on the first face and connected to the first electrode;
and
at least one second terminal that is formed on the first face and connected to the second electrode;
iii) a plurality of insulating layers interposed between the principal-face-side connecting terminals, and the at least one first terminal and the at least one second terminal, the insulating layers comprising a most-reverse face side insulating layer that is a layer nearest to the reverse face;
iv) at least one first converting-conductor layer formed on a surface of the most-reverse face side insulating layer, the surface facing to the reverse face, wherein the first converting-conductor layer is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is connected or is electrically connected through a conductive connecting material to at least one of the first terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side;
and
v) at least one second converting-conductor layer formed on the surface, wherein the second converting-conductor layer is insulated from the first converting-conductor layer, is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is connected or is electrically connected through a conductive connecting material to at least one of the second terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/183,521Filed 28 Jun 2002
Priority: JP P. 2001-36768830 Nov 2001
Published: 31 Oct 2002
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 1/0231
Using auxiliary mounted passive components or auxiliary substances: capacitors or dielectric substances
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/685
Shapes or dispositions thereof: comprising multiple insulating layers
H05K 1/113
Directly combined with via connections: via provided in pad; Pad over filled via

Family

Application10/012,312Continuation in part · filed 12 Dec 2001
Application10/183,521Continuation in part · filed 28 Jun 2002
US 2002/0086561 A1Published application
US 6,577,490 B2Related patent
US 2002/0159243 A1This patent

From the US filing history. Foreign family members aren’t listed.