Layered product and capacitor
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
Estimating the term…
A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 μm or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 μm or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.
A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein a surface roughness of the resin thin film layer is not more than 0.1 μm.
A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein the resin thin film layer contains no protrusion forming component.
A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein a surface roughness of the metal thin film layer is not more than 0.1 μm.
A layered product comprising an element layer, reinforcement layers deposited on both sides of the element layer, and protective layers deposited further on both sides of the reinforcement layers,
A layered product comprising an element layer and reinforcement layers deposited on both sides of the element layer,
Dependencies are inferred from the claim text.